Relife RL-403 - Low Melting Point Solder Paste (183ºC) Sn63/Pb37 - 10g
€6.35
This low-melting-point (183°C) solder paste is composed of Sn63/Pb37, offering good fluidity for thin soldering and reballing of CPU ICs. It has a viscosity of 160-230 Pa.s and particles of 20-38 µm, weighing 10 cc. Recommended for PCB maintenance applications, with storage between 0 and 10 °C to preserve its properties.
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High-quality paste, ideal for soldering and reballing IC Chip CPUs.
Technical Specifications:
- Melting Point: 183 °C
- Composition: Sn63/Pb37
- Viscosity: 160-230 Pa.s
- Particle Size: 20-38 µm
- Weight: 10 cc
Note:
- For optimal use, store in an environment at 0-10 °C.
510527
Specific References
- EAN13
- 6971806510526
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This low-melting-point (183°C) solder paste is composed of Sn63/Pb37, offering good fluidity for thin soldering and reballing of CPU ICs. It has a viscosity of 160-230 Pa.s and particles of 20-38 µm, weighing 10 cc. Recommended for PCB maintenance applications, with storage between 0 and 10 °C to preserve its properties.