DOUBLE SIDED ADHESIVE RUG (THERMAL PAD) 100X22X1MM
Security policy
Delivery policy
Product description
Size: 100X22X1MM
Thickness: 1.0mm
Continuous temperature: -40ºC-260ºC
Thermal conductivity: 3.2 w / m-K
Breakdown voltage: 4kv / mm
Advantage: The main purpose of the selection of the thermal silica film is to reduce the contact thermal resistance
between the heat source and the heat sink surfaces at the mating surfaces. Thermal silica film with gaps
well filled with the contact surface
Usage: use for control board, motor, electronics, auto mechanics, computer host, laptops, DVD,
VCD, LID, decoders and any cooling modules need to be filled and materials for electricity and
Electronic products.
Application:
LED Industry Uses
Energy industry
Communications industry
Automotive electronics industry
Home appliance industry